Assistant Prof. DinhPhuc Tran

Education/Experience: Ph. D., Mechanical Engineering, National Central University, Taiwan

Email: dptran@ntut.edu.tw

Office: Room 714-1, Integrate Technology Complex

Phone: 886-2-2771-2171 Ext: 2071

Laboratory: Advanced Semiconductor Packaging and Metallization Laboratory (Room 320-1, Integrated Technology Complex)

Academic Resources: Portal | Scopus

Research: 3D IC packaging technologies, Metallurgical reactions in solder joints, Electrodeposition of low-resistance, high-strength nanotwinned copper for semiconductor packaging, Thermal stress analysis in metal hydride storage vessels, Fatigue-fracture-creep-stress–strain analysis, mechanical characterization of materials, Finite element analysis.

Bio:

Dr. Dinh-Phuc Tran received his B.S. and MSc. degrees in Mechanical Engineering from Ho Chi Minh City University of Technology, Vietnam, in 2011 and 2013, respectively, and the Ph.D. degree from National Central University, Taiwan, in 2018. He worked as a postdoctoral fellow at University of the Western Cape, South Africa (2019), National Taiwan University, Taiwan (2020), and National Yang Ming Chiao Tung, Taiwan (2020-2025). In 2025, he joined the Department of Mechanical Engineering at National Taipei University of Technology as an Assistant Professor. Dr. Tran has published 60+ SCI journal articles. His current research interests include low-temperature Cu-to-Cu direct bonding, high-strength nanotwinned Cu lines and films for 3D IC integration, and the reliability of flip-chip solder joints and microbumps in semiconductor packaging, with a focus on electromigration and metallurgical reactions. Link: https://sites.google.com/view/dptlab/bio